8797 - Qualcomm
Based on developer board schematics and Geekbench 5 leaks from 2020, here are the most reliable specifications for the Qualcomm 8797:
| Component | Specification |
| :--- | :--- |
| Product Code | Qualcomm 8797 (Engineering Sample) |
| Final Name | Snapdragon 8cx Gen 2 (SC8180XP) |
| Process | TSMC 7nm (N7P) |
| CPU | Kryo 495 (Octa-core)
- 4x Cortex-A76-like @ 3.15 GHz
- 4x Cortex-A55-like @ 1.8 GHz |
| GPU | Adreno 690 (up to 2.1 TFLOPS, DirectX 12) |
| Memory | LPDDR4X-2133 (up to 32 GB) |
| TDP (Thermal Design Power) | 7 Watts (fanless) – up to 15W burst |
| ISP (Image Signal Processor) | Spectra 390 (2x 14-bit, 32MP single / 16MP dual) |
| Connectivity | Snapdragon X55 5G Modem (external, 7Gbps down) |
| AI Engine | Hexagon 690 (9 TOPS) |
Why this matters: Unlike phone chips that throttle under 3W, the 8797’s 7W TDP allowed for sustained multi-core performance. In leaked Cinebench R20 tests, the 8797 scored nearly double the Snapdragon 855, rivaling the Intel Core i5-8250U.
The Qualcomm 8797 is more than just a forgotten model number. It represents a pivotal moment when Qualcomm tried to leapfrog from smartphones into the PC big leagues. It failed—not because the silicon was bad, but because the software ecosystem wasn’t ready, and a rival from Cupertino had a faster, smaller transistor.
Today, the 8797 serves as a historical milestone. It reminds us that great hardware needs great software and perfect timing. As Qualcomm reboots its PC assault with the Oryon-powered Snapdragon X series, the lessons learned from the 8797’s quiet, canceled, and confused legacy are being applied to build genuine Intel and Apple killers.
For hardcore enthusiasts, the Qualcomm 8797 will always be the "chip that almost was"—a brilliant prototype that arrived two years too early and stayed one node too late. qualcomm 8797
Did you find a reference to "Qualcomm 8797" in a recent leak? It is likely a misidentification of a newer chip. Always cross-reference with the final marketing name (Snapdragon 8cx Gen 2) and check the manufacturing date.
The Qualcomm 8797 (also known as the Snapdragon QAM8797P) is a flagship automotive SoC (System on a Chip) designed for the next generation of software-defined vehicles. Part of the Snapdragon Automotive Platform Ultimate Edition, it serves as a central computing hub that integrates both intelligent cockpit and advanced driving assistance systems (ADAS) into a single architecture. Key Specifications & Capabilities
Performance: Features a single-chip computing power of 640 TOPS (Tera Operations Per Second).
Dual-Chip Configuration: Frequently implemented in pairs (as seen in the Leapmotor D19) to deliver a combined 1,280 TOPS, creating a "central domain control" setup where one chip handles the cockpit and the other manages L3+ autonomous driving.
AI Integration: Specifically designed to support edge-side AI, including multimodal large language models (like Alibaba's Tongyi Qianwen) for "AI home butler" functions and VLA (Vision-Language-Action) models for driving. Based on developer board schematics and Geekbench 5
System Integration: It can process data from up to 13 multimodal sensors simultaneously and supports more than 30 advanced driving functions, including urban and highway navigation assistance. Market Position & Adoption
Target Competitor: Positioned to compete directly with high-performance automotive platforms like the NVIDIA Thor series. Key Partners:
Leapmotor: The D19 flagship SUV is the first production model to use dual 8797 chips.
Others: Automakers like BYD, GAC, Li Auto, and XPeng have been identified as potential partners or are in contact regarding the platform.
Software Ecosystem: Supported by automotive OS platforms like BlackBerry QNX (on ARMv9 architecture). The Qualcomm 8797 is more than just a
Qualcomm 8797 (officially part of the Snapdragon Elite Snapdragon Ride Elite
series) is a flagship automotive System-on-Chip (SoC) designed for centralized vehicle computing. It was prominently unveiled in early 2026 as a critical component for next-generation "AI-defined vehicles," capable of unifying intelligent cockpit and driver assistance functions on a single high-performance platform. Key Technical Specifications Computing Power : Offers a single-chip equivalent power of (Tera Operations Per Second). Dual-Chip Configuration : When used in a dual-chip setup, it reaches a massive
, allowing one chip to specialize in the intelligent cockpit while the other focuses on advanced driving assistance (ADAS). AI Performance : Optimized for large model inference; it can run 14 billion parameter (14B) models at 40-60 FPS and 7B models at 60-72 FPS locally. Integration Capabilities
: Merges infotainment, digital cockpit, and ADAS functions into a single system, significantly reducing complexity for automakers.
The main rival for the QCS8797 is the NVIDIA Jetson Orin series.
| Feature | Qualcomm QCS8797 | NVIDIA Jetson Orin NX | | :--- | :--- | :--- | | Architecture | ARM + Hexagon NPU | ARM + CUDA GPU | | Strength | Power Efficiency & 5G Integration | Raw GPU Compute & Ecosystem | | Software | Qualcomm AI Engine / Inference SDK | CUDA / TensorRT | | Best Use Case | Drones, Battery-Operated Robots | Factory Machines, Server-room Edge |
Winner? It depends on the battery. If you are plugged into a wall, NVIDIA’s CUDA ecosystem is easier to code for. If you are building a drone that needs to fly for 45 minutes while crunching AI data, Qualcomm wins.
